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Silica sol aqueous solution, CMP polishing slurry

  • Silica sol aqueous solution,  CMP polishing slurry
  • Silica sol aqueous solution,  CMP polishing slurry
Model No.︰-
Brand Name︰Huihe
Country of Origin︰China
Unit Price︰CNY ¥ 12 / pc
Minimum Order︰30 pc
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Product Description

 

CMP slurry characteristics.

The content of metal ions is very low, and the particle size distribution is uniform in monodisperse system. High consistency of product quality between batches. The size and shape of particles can be controlled freely. Be stable in dispersion and difficult to coalesce or settle. High speed, no crystal, easy to clear. The surface quality base is good, Chow ring has strong selection ability. Sapphire: SPS Stainless Steel: SLPS. Aluminum: AAPS. Silicon: ssps. Gallium Arsenide: Gaps. Hard Drive: dps. Artificial Body: Alps. Ceramics: CPS

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